globalchange  > 全球变化的国际研究计划
项目编号: 1605815
项目名称:
GOALI: Collaborative Research: Interactions of Polishing and Incidental Nanoparticles in Chemical Mechanical Planarization Processes with Artificial Membranes and Human Cell Lines
作者: Edward Bouwer
承担单位: Johns Hopkins University
批准年: 2016
开始日期: 2016-08-01
结束日期: 2019-07-31
资助金额: 209996
资助来源: US-NSF
项目类别: Standard Grant
国家: US
语种: 英语
特色学科分类: Engineering - Chemical, Bioengineering, Environmental, and Transport Systems
英文关键词: cmp process ; human cell line ; artificial cell membrane ; research ; biological interaction ; research result ; 1604647chemical mechanical planarization ; chemical process ; nanoparticle-membrane interaction ; manufacturing process ; important semiconductor manufacturing process
英文摘要: PI: Chen, Kai Loon
#: 1605815
COLLABORATIVE
PI: Aravamudhan, Shyam
#: 1604647

Chemical Mechanical Planarization (CMP) is one of the important semiconductor manufacturing processes used in the production of advanced electronic devices such as computers, smart phones, and tablets. The CMP process uses huge volumes (millions of tons) of silica, ceria, or alumina particles in the form of abrasive slurries to planarize electronic circuits during the manufacturing process. However, environmental safety and health (ESH) impacts from the release of used CMP slurries containing nanoparticles into the natural environment and workplace exposure are largely unknown. The objective of this research is to study the ESH impacts and interactions of both pristine and used CMP nanoparticles with artificial cell membranes and human cell lines.

Even though NPs are used in a large-scale in the CMP process during the manufacture of integrated circuits, little is known about their environmental and human health impacts, particularly the transformation of nanoparticles during the CMP process and their corresponding workplace exposure, fate, behavior, and toxicity. This is mainly due to the inability to obtain access to the transformed nanoparticle slurries from the CMP process. The main objectives of this project are to (1) systematically investigate, detect, and characterize the transformation of nanoparticle slurries during the CMP processes; (2) examine the influence of CMP and incidental nanoparticles to attach to and disrupt artificial cell membranes and their ability to affect human cell lines; and (3) determine the role of nanoparticle-membrane interactions on nanoparticle toxicity.

This research has the potential to be transformative because a strong understanding of the biological interactions of pristine and transformed CMP NPs is not only relevant to the electronics industry, but also has wider applicability for a number of other nanoparticle applications, which routinely undergo life-cycle transformations through different physical and chemical processes. The research results will be disseminated through publications in peer-reviewed journals and student presentations at national scientific meetings. They will also be incorporated into undergraduate and graduate courses and community outreach programs, including K-12 scientific activities for an inner-city Baltimore elementary/middle school, NanoDay activities for the local community, NanoBus after-school program, and community college engagement. Lastly, the active involvement of an industrial partner will result in implementation of better engineering controls and safer CMP processes.
资源类型: 项目
标识符: http://119.78.100.158/handle/2HF3EXSE/91653
Appears in Collections:全球变化的国际研究计划
科学计划与规划

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Recommended Citation:
Edward Bouwer. GOALI: Collaborative Research: Interactions of Polishing and Incidental Nanoparticles in Chemical Mechanical Planarization Processes with Artificial Membranes and Human Cell Lines. 2016-01-01.
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